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- **Features**:
- TriCore™ 1.3M 32-bit RISC architecture CPU, Harvard architecture, single-cycle execution
- 1.5 MB embedded program Flash with ECC
- 32 KB data Flash for scalable EEPROM emulation
- 76 KB on-chip SRAM + 8 KB instruction cache + 8 KB Overlay RAM (OVRAM); total SRAM (including cache): 108 KB
- 16 KB Boot ROM (BROM)
- 80 MHz maximum CPU clock frequency
- Floating Point Unit (FPU)
- 2 CAN nodes (MultiCAN, 64 buffers)
- 36 A/D input lines (including 2-channel fast ADC + 32-channel standard ADC)
- 8-channel DMA controller
- Programmable Interrupt Controller (PIC)
- General Purpose Timer Array (GPTA)
- Micro Second Link Interface (MLI)
- Micro Second Channel (MSC)
- Synchronous Serial Channel (SSC)
- Asynchronous/Synchronous Serial Channel (ASC)
- On-chip PLL clock generation
- On-chip voltage regulator
- Memory Checker Unit
- On-Chip Debug Support (OCDS) / JTAG interface
- Automotive-grade operating temperature range: -40°C to +125°C
Technical Specifications
- **Core Processor**: TriCore™ 1.3M (32-bit RISC, Harvard architecture)
- **Program Memory (Flash)**: 1.5 MB (with ECC)
- **Data Flash**: 32 KB (for EEPROM emulation)
- **Data RAM**: 76 KB SRAM + 8 KB instruction cache + 8 KB OVRAM; total 108 KB (including cache)
- **Boot ROM**: 16 KB
- **Max CPU Clock Frequency**: 80 MHz
- **ADC Resolution**: 8-bit / 10-bit / 12-bit (2-channel fast ADC + standard ADC) 32 channels)
- **ADC Channels**: 36 (including FADC)
- **CAN Nodes**: 2 (MultiCAN, 64 buffers)
- **DMA Channels**: 8
- **Serial Interfaces**: 2×ASC, 2×SSC, 1×MSC, 2×MLI
- **Timers**: GPTA (General Purpose Timer Array)
- **Floating-Point Unit**: Yes (FPU)
- **I/O Pins**: 81 general-purpose I/O
- **Supply Voltage**: 1.42 V – 1.58 V (core voltage), 3.3 V I/O
- **Data Bus Width**: 32-bit
- **Operating Temperature Range**: -40°C to +125°C (TA)
- **Package Type**: PG-LQFP-176 (24 mm × 24 mm × 1.4 mm, 0.5 mm pin pitch)
- **Mounting Type**: Surface Mount (SMD/SMT)
- **Packaging**: Tape & Reel (500 units/reel)
- **RoHS Status**: Lead-free / RoHS compliant, halogen-free
- **Product Lifecycle**: Mass production (Active and Preferred)
Notes
- **Compatibility**: Please verify compatibility with your application before purchasing. - Package/Footprint: PG-LQFP-176 (24 mm × 24 mm, 0.5 mm pitch); verify PCB pad design
- Supply Voltage: Core 1.42V–1.58V, I/O 3.3V; ensure stable external power supply
- Temperature Rating: -40°C to +125°C; ensure compatibility with the application environment
- Marking/Suffix: Suffix "HL" indicates temperature range and package type; "BD"/"BB" denote different stepping versions
- Pin Compatibility: TC1766 series is pin-compatible with models such as TC1764 and TC1762
- Development Tools: Supports DAvE (Digital Application Virtual Engineer) development tools
- **Installation Instructions**:
- ESD Protection: Chip is sensitive to electrostatic discharge; wear an anti-static wrist strap before handling
- Soldering Temperature: Reflow peak temperature ≤260°C; compliant with lead-free soldering standards
- Decoupling Capacitors: Connect appropriate ceramic decoupling capacitors in parallel between VDD/VSS pins and ground
- Crystal Oscillator Connection: Connect external crystal or resonator according to the recommended circuit in the datasheet
- Thermal Design: Ensure sufficient PCB copper area; add thermal vias if necessary
- Operate the device within the specified temperature range
- **Troubleshooting**:
- Chip fails to start: Check supply voltages (1.42V–1.58V core, 3.3V I/O), reset signal, crystal oscillation, and PLL configuration
- Flash programming failure: Check JTAG/OCDS connection, programming voltage, and Flash write-protection settings
- No I/O response: Check port direction register configuration, pull-up/pull-down resistors, and pin integrity
- Abnormal ADC readings: Check reference voltage connection and analog input signal range
- CAN communication failure: Check CAN transceiver connection, termination resistors, and baud rate configuration
- Abnormal DMA transfer: Check DMA channel configuration, source/destination addresses, and transfer length
- **Alternative Model Reference**:
- - SAK-TC1766-192F80HL BD (different stepping version)
- SAK-TC1766-192F80HL BB (different stepping version)
- SAK-TC1764-128F80HL (128 KB Flash, lower capacity version)
- SAK-TC1767-256F133HL (256 KB Flash, 133 MHz, higher performance version)
- SAK-TC1762-128F80HL (128 KB Flash, lower capacity version)
- Replacement models should be selected based on specific Flash/RAM capacity, clock frequency, and package requirements.
- **Technical Support**: If further technical support is required, it is recommended to contact Infineon Technologies or a professional automotive electronics repair service.
Summary
The SAK-TC1766-192F80HL is a high-performance, 32-bit, automotive-grade microcontroller manufactured by Infineon Technologies, housed in a PG-LQFP-176 package. Its TriCore™ 1.3M architecture, 1.5 MB Flash, 108 KB SRAM (including cache), 80 MHz operating frequency, Floating Point Unit (FPU), dual CAN nodes, 36 ADC inputs, and extensive serial interfaces (ASC/SSC/MSC/MLI) make it an ideal choice for high-performance embedded applications such as automotive engine control, transmission control, drive-by-wire systems, and industrial robot control. The chip supports on-chip debugging (OCDS/JTAG) and DAvE development tools, facilitating development and maintenance. Its automotive-grade operating temperature range (-40°C to +125°C) ensures high reliability. During repair or replacement, key factors such as package compatibility (PG-LQFP-176), core supply voltage (1.42V–1.58V), I/O voltage (3.3V), crystal/PLL configuration, and thermal design must be considered to ensure stable system operation.
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